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Intel announces next generation of chips for next-generation semiconductors, chipsets, and semiconductor technology

article Posted September 25, 2018 09:31:50 Intel has released details on the next generation silicon chips it will use in the upcoming Intel Edison line of processors.

The chipmaker has revealed details about the next-gen Intel Edison chipsets and has also introduced a new version of its X299 chipset for the desktop.

The X299 and X299-X will have up to 8 cores and up to 4 threads, and the chipsets will have both 8MB of L3 cache and 4MB of GDDR5 memory.

These chipsets are designed to take advantage of Intel’s new microarchitecture that is designed to scale to new workloads and deliver faster performance than the existing Intel Xeon processor family.

The new generation of Intel Edison products will be available by the end of 2018, Intel said.

The company has also released a new X299/X299-E, which has up to 10 cores and 6 threads, with up to 32MB of DDR4-2666 memory.

The high-end versions of these chipsets offer up to a 65W TDP.

Intel Edison chips will feature up to 256MB of ECC RDIMM, and 64MB of non-ECC RDIMMs, which are designed for fast random access memory.

The company also introduced support for DDR4 ECC memory in the X299 chipsets.

The first of the new processors to be announced is the X399.

The chipmaker also announced that the X79 chipset will also feature support for 64MB ECC, 32MB non-ecC, and ECC RAM, which it claims are the first for Intel’s next generation processors.

These new chipsets have a TDP of 180W and will be the first Intel chipsets to feature up-to-4 threads.